Display device

ABSTRACT

According to one embodiment, a display device includes a first substrate and an external circuit, the first substrate including a first area, a second area, and wirings, the first area including a display area in which pixels are arranged the external circuit being mounted on the second area. The wirings are electrically connected to the external circuit, provided in the first area and the second area, and arranged in the first direction. At least one of the wirings is inclined with respect to a second direction orthogonal to the first direction in a first portion of the second area. The first substrate is bent in the first portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/631,300 filed Jun. 23, 2017, and is based upon and claims the benefitof priority from Japanese Patent Application No. 2016-125569, filed Jun.24, 2016, the entire contents of each of which are incorporated hereinby reference.

FIELD

Embodiments described herein relate generally to a display device.

BACKGROUND

Conventionally, in a display device such as an organicelectroluminescent display device or a liquid crystal display device, aglass substrate is used as the base of a display panel. Recently, aflexible display device in which a resin substrate such as a polyimideresin substrate is used as the base of a display panel and flexibilityis given to the display panel has been developed.

For example, in such a flexible display device, it is possible to reducethe size of a frame by bending toward a display area, a wiring area inwhich various wirings are formed outside the display area. In this case,however, the wirings are at risk of being damaged by stress resultingfrom the bending.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a display device of a firstembodiment.

FIG. 2 is a diagram showing a state where a wiring area of the displaydevice is folded.

FIG. 3 is a schematic plan view of the wiring area.

FIG. 4 is an explanatory diagram showing an effect of the wiring area.

FIG. 5 is a schematic plan view of a wiring area of a second embodiment.

FIG. 6 is a diagram showing a shape of a wiring of a third embodiment.

FIG. 7 is a schematic plan view of a wiring area using the wiring formedinto the shape shown in FIG. 6.

FIG. 8 is a schematic plan view of a wiring area of a fourth embodiment.

FIG. 9 is a schematic plan view of a wiring area of a fifth embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, a display device includes: afirst substrate including a first area including a display area in whichpixels are arranged, a second area adjacent to the first area, andwirings; and an external circuit mounted on the second area of the firstsubstrate. The wirings are electrically connected to the externalcircuit, provided in the first area and the second area, and arranged inthe first direction. At least one of the wirings is inclined withrespect to a second direction orthogonal to the first direction in afirst portion of the second area. The first substrate is bent in thefirst portion.

According to this structure, it is possible to prevent damage of thewirings due to the bending of the second area and enhance reliability ofthe display device.

Embodiments will be described hereinafter with reference to theaccompanying drawings.

The disclosure is merely an example, and proper changes in keeping withthe spirit of the invention, which are easily conceivable by a person ofordinary skill in the art, come within the scope of the invention as amatter of course. In addition, in some cases, in order to make thedescription clearer, the respective parts are illustrated in thedrawings schematically, rather than as an accurate representation ofwhat is implemented. However, such schematic illustration is merelyexemplary and in no way restricts the interpretation of the invention.In the drawings, reference numbers of continuously arranged elementsequivalent or similar to each other are omitted in some cases. Inaddition, in the specification and drawings, structural elementsequivalent or similar to those described in connection with precedingdrawings are denoted by the same reference numbers, and detaileddescription thereof is omitted unless necessary.

In each embodiment, a display device comprising an organicelectroluminescent (EL) display element will be described as an exampleof a display device. However, each embodiment does not precludeapplication of individual technical ideas disclosed in the embodiment todisplay devices using other display elements. Here, the display elementsinclude, for example, a display device comprising a liquid crystaldisplay element, an electronic-paper type display device comprising anelectrophoresis element, and the like.

First Embodiment

FIG. 1 is a schematic plan view of a display device 1 of the firstembodiment. The display device 1 includes a display panel 2. The displaypanel 2 includes a display area DA and a surrounding area SA whichsurrounds the display area DA. In the display area DA, pixels PX arearranged in a matrix. In the present embodiment, the pixel PX includesan organic EL element and a switching element (thin-film transistor).For example, the organic EL element includes a pixel electrode connectedto the switching element, and an organic luminescent layer which emitslight according to voltage between the pixel electrode and a commonelectrode provided across a plurality of pixels PX.

In the surrounding area SA, the display panel 2 includes verticaldrivers 6L and 6R and a horizontal diver 7. In FIG. 1, the verticaldriver 6L is formed along the left side of the display area DA, and thevertical driver 6R is formed along the right side of the display areaDA. The horizontal driver 7 is formed along the lower side of thedisplay area DA. Each of the drivers 6L, 6R and 7 is a peripheralcircuit and drives each pixel PX under control of a driver IC 5.

The display panel 2 further includes a wiring area LA provided on thelower side of the horizontal driver 7 in the drawing, and wirings L1 andL2 formed in the wiring area LA. For example, the wirings L1 and L2 areformed of a metal material. In the example shown in FIG. 1, threewirings L1 extend from each of the vertical drivers 6L and 6R, andnumerous wirings L2 extend from the horizontal driver 7. For example,the wiring L1 is a power supply line which supplies a drive voltage toeach of the vertical drivers 6L and 6R. For example, the wiring L2 is asignal line which supplies an image signal for driving each pixel PX. Inthe wiring area LA, wirings other than the wirings L1 and L2 may also beformed. The wiring area LA may also be referred to as an outer leadbonding (OLB) pad.

Each of the wirings L1 and L2 is arranged in an X direction (arrangementdirection). Further, each of the wirings L1 and L2 extends in a Ydirection either linearly or windingly. In the present embodiment, the Xdirection and the Y direction are orthogonal to each other in planarview. However, the X direction and the Y direction may cross each otherat an angle other than a right angle.

Note that the direction (thickness direction of the display panel 2)orthogonal to the X direction and the Y direction is defined as a Zdirection. Further, both sides of the wiring area LA arranged in the Xdirection will be referred to as a first side S1 and a second side S2,and both sides of the wiring area LA arranged in the Y direction will bereferred to as a third side S3 and a fourth side S4. In the exampleshown in FIG. 1, the sides S1 and S2 correspond to the left and rightshort sides of the wiring area LA, and the sides S3 and S4 correspond tothe upper and lower long sides of the wiring area LA. The third side S3is located between the fourth side S4 and the display area DA.

The display device 1 further includes a first circuit board 3, a secondcircuit board 4, and the driver IC 5. In the vicinity of the fourth sideS4, the first circuit board 3 is connected to the display panel 2, forexample, via an anisotropic conductive film. The second circuit board 4is connected to the first circuit board 3, for example, via ananisotropic conductive film. The first circuit board 3 and the secondcircuit board 4 are, for example, flexible printed circuits (FPCs). Thedriver IC 5 is a controller which controls the drivers 6L, 6R and 7 andis mounted on the first circuit board 3, for example, by a chip-on-film(COF) method. Note that, in the present embodiment, the first circuitboard 3, the second circuit board 4, and the driver IC 5 correspond toexternal circuits.

Each wiring L1 is connected to the second circuit board 4 via the firstcircuit board 3. Each wiring L2 is connected to the driver IC 5 on thefirst circuit board 3. To the second circuit substrate 4, varioussignals and power are supplied from the controller of an electronicdevice on which the display device 1 is mounted.

The display panel 2 includes a flexible substrate 11. For example, theflexible substrate 11 includes the display area DA, the surrounding areaSA, and the wiring area LA. As the flexible substrate 11, for example, apolyimide substrate can be used. Note that the flexible substrate 11 maybe formed of another resin. Note that, the flexible substrate 11corresponds to a first substrate, and in the present embodiment, thedisplay area DA and the surrounding area SA correspond to a first area,and the wiring area LA corresponds to a second area.

The display device 1 having the above-described structure can be mountedon the electronic device, for example, in a state where the wiring areaLA is folded. FIG. 2 is a schematic diagram showing a state where thewiring area LA is folded. Here, the figure shows a cross-section of thedisplay device 1 taken parallel to the Y-Z plane.

In the wiring area LA, the display panel 2 includes the flexiblesubstrate 11, a protection layer 20, and a wiring layer 30. The wiringlayer 30 is a layer including the above-described wirings L1 and L2 andis formed on the flexible substrate 11. The protection layer 20 is alayer covering the wiring layer 30 and includes a protection film 21formed of an insulating resin material. Note that, in addition to thewiring layer 30, another layer may be further provided between theflexible substrate 11 and the protection layer 20. Similarly, theprotection layer 20 may further include another layer in addition to theprotection film 21.

The display panel 2 has a first surface F1 and a second surface F2 whichis opposite to the first surface F1. In the wiring area LA, the firstsurface F1 corresponds to the back surface of the flexible substrate 11,and the second surface F2 corresponds to the front surface of theprotection layer 20. In the display area DA shown in FIG. 1, the secondsurface F2 corresponds to the display surface.

Note that, in the display area DA, various insulating layers,semiconductor layers, metal layers, pixel electrodes, common electrodes,organic luminescent layers, polarizing layers, and the like are arrangedon the flexible substrate 11. These elements may partially extend in thewiring area LA shown in FIG. 2.

The first circuit board 3 is connected to the first surface F1 of thedisplay panel 2. For example, as shown in the drawing, the wiring layer30 (each of the wirings L1 and L2) is connected to the first circuitboard 3 via a through hole 10 a provided in the flexible substrate 11.Note that the first circuit board 3 may also be connected to the secondsurface F2 of the display panel 2.

Each of the wirings L1 and L2 of the wiring layer 30 has a multilayerstructure in which a titanium (Ti) layer having a thickness of 0.1 μm,an aluminum (Al) layer having a thickness of 0.5 μm, and a titaniumlayer having a thickness of 0.05 μm are stacked in this order. Note thateach of the wirings L1 and L2 of the wiring layer may also have amultilayer structure of other materials.

In the wiring area LA, the display panel 2 is bent at 180 degrees insuch a manner that the flexible substrate 11 will be placed on the innerside of the bend. At this time, the axis AX of the bending is, forexample, parallel to the X direction. The display panel 2 may also bebent at another angle such as an angle of 90 degrees.

An adhesive layer 40 is formed between the first circuit board 3 and thefirst surface F1 of the display panel 2 which are opposed to each other.The first circuit substrate 3 and the first surface F1 are attached toeach other by the adhesive layer 40, and the display panel 2 ismaintained to be folded, accordingly. In the example shown in FIG. 2, aspacer 41 is supported by the adhesive layer 40. The end of the spacer41 is smoothly rounded and is brought into contact with the firstsurface F1. As the spacer 41 is provided, the folded state of the wiringarea LA can be stably maintained, and the curvature of the folded wiringarea LA can be easily controlled.

In the following description, a portion of the flexible substrate 11located in the wiring area LA and having curvature will be referred toas a bend area BA. Further, assuming the bend axis AX as the center ofcurvature in the Y-Z plane, the direction along the curve will bereferred to as a C direction. In the present embodiment, the X directioncorresponds to a first direction, and the Y direction and the Cdirection correspond to a second direction. In the bend area BA, tensilestress and compressive stress are produced. The maximum tensile stressis applied to the second surface F2, and the maximum compressive stressis applied to the first surface F1. When the tensile stress or thecompressive stress is applied to the wiring layer 30, there is apossibility of the wirings L1 and L2 of the wiring layer 30 beingdamaged and broken. Note that, in the present embodiment, the bend areaBA corresponds to a first portion.

In the thickness direction of the display panel 2, there is a neutralplane in which both of the above-described compressive stress andtensile stress are zero. It is possible to adjust the radius ofcurvature ρ of the neutral plane by adjusting the thicknesses of theflexible substrate 11 and the protection film 20. Therefore, if thethicknesses of the flexible substrate 11 and the protection layer 20 aredetermined such that the wiring layer 30 coincides with the neutralplane, the stress will not be applied to the wiring layer 30, andconsequently the damage of the wirings L1 and L2 can be prevented.

However, it is difficult to align the conductive layer 30 with theneutral plane across the entire bend area BA. In particular, the centralarea and the peripheral area in the direction along the bend axis AX (Xdirection) have different deformation characteristics, and in theperipheral area, the neutral plane tends to have a substantially smallerradius of curvature ρ. Accordingly, tensile stress is applied to thewiring layer 30 in the peripheral area, and the wirings L1 and L2 tendto be damaged by the stress.

A structure for preventing the damage of each of the wirings L1 and L2will be described with reference to FIGS. 3 and 4. FIG. 3 is a schematicplan view of the wiring area LA. At the time of being mounted, as shownin FIG. 2, the wiring area LA in the bend area BA will be folded.

In the example shown in FIG. 3, the wiring area LA includes anintegration area IA in which the wirings L1 and the wirings L2 areintegrated, respectively. In the integration area IA, a width W betweenthe wiring L1 closest to the side S1 and the wiring L1 closest to theside S2 decreases with increasing distance from the third side S3.

Outside the integration area IA, the wirings L1 and L2 extend parallelto the Y direction. On the other hand, in the integration area IA, thewirings L1 and L2 extend in a direction which crosses the Y direction(in the bend area BA, the C direction orthogonal to the bend axis AX) atan angle θ. The angle θ is an angle other than a right angle. Forexample, each of the wirings L1 and L2 closer to each of the sides S1and S2 crosses at a larger angle θ, and each of the wirings L1 and L2closer to the center in the X direction crosses at a smaller angle θ.The angle θ for the wirings L1 closest to the sides S1 and S2 should bean angle of 10 degrees or more and less than 90 degrees, more desirable,an angle of 30 degrees or more and less than 90 degrees. Note that atleast one of the wirings L1 and L2 in the bend area BA is formed in sucha manner that the wirings L1 and L2 do not orthogonally cross the Xdirection.

In the example shown in FIG. 3, spaces are provided between the thirdside S3 and the integration area IA and between the fourth side S4 andthe integration area IA, respectively. Note that one or both of thesespaces may not be provided.

To reduce the stress to be applied to the wirings L1 and L2, the bendarea BA should preferably be set to a range where the wirings L1 and L2are highly integrated, more desirable, a range where the wirings L1 andL2 are most highly integrated. Here, the degree of integrationcorresponds to the rate of change of the width W in the Y direction (orthe C direction). A degree of integration can be represented as Δw/Δcwhere Δc is a length of the bend area BA in the C direction and Δw is achange rate of the width W in an interval Δc. In the example shown inFIG. 3, the integration area IA has the highest degree of integration.Therefore, the bend area BA is set in such a way as to overlap theintegration area IA.

An effect of the wiring area LA having the above-described structurewill be described with reference to FIG. 4. FIG. 4(a) shows a wiring Lof a comparative example, while FIG. 4(b) shows either of the wirings L1and L2 of the present embodiment.

The wiring L shown in FIG. 4(a) extends parallel to the C direction inthe bend area BA. Assuming that the wiring L is deviated from theneutral plane, a tensile stress σ1 to be applied to the wiring L in thebend area BA can be represented as σ1=E·ε=E·h/ρ where E is a Young'smodulus of the wiring L, ε is a strain, h is a distance from the neutralplane to the wiring L in the radius direction, and ρ is a radius ofcurvature of the neutral plane. Further, when the wiring area LA is bentat 180 degrees in the bend area BA, a length D1 of the wiring L in thebend area BA can be represented as D1=π·ρ where π is the circularconstant.

On the other hand, the wiring L1 or L2 shown in FIG. 4(b) is inclined atan angle θ with respect to the C direction in the bend area BA. In thiscase, a tensile stress σ2 to be applied to the wiring L1 or L2 in thebend area BA can be represented as σ2≈E·ε=E·h·cos θ/ρ. Further, when thewiring area LA is bent at 180 degrees in the bend area BA, a length D2of the wiring L1 or L2 in the bend area BA can be represented asD2=D1/cos θ. That is, the effective radius of curvature of the wiring L1or L2 will be greater than that of the case shown in FIG. 4(a). Forexample, the wiring L1 or L2 is on an elliptical orbit.

In the present embodiment, since 0<θ<90, σ1>σ2 is satisfied in the bendarea BA. That is, it is possible to reduce the tensile stress to beapplied to each of the wirings L1 and L2 by inclining each of thewirings L1 and L2 at the angle θ with respect to the C direction.

Further, as described above, in the highly integrated range, the anglebetween each of the wirings L1 and L2 and the C direction is increased.Therefore, it is possible to enhance the effect of reducing the stressto be applied to each of the wirings L1 and L2 by setting the bend areaBA in the highly integrated range such as the integration area IA.

As described above, according to the present embodiment, it is possibleto prevent damage of each of the wirings L1 and L2 and improvereliability of the display device 1 by reducing stress to be applied toeach of the wirings L1 and L2. In addition to the above, various otherfavorable effects can be obtained from the present embodiment.

Second Embodiment

FIG. 5 is a schematic plan view of the wiring area LA of the secondembodiment. In the example shown in the drawing, no space is providedbetween the integration area IA and the third side S3. According to thisstructure, since the wirings L1 and L2 are highly integrated near thethird side S3 also, the bend area BA can be set in a location near thethird side S3. Therefore, in a state where the wiring area LA is folded,the frame of the display device 1 will be further reduced in size.

Note that, in the example shown in FIG. 5, the space between theintegration area IA and the fourth side S4 may not be provided.

Third Embodiment

The third embodiment is different from the above-described embodimentsin terms of the shape of each of the wirings L1 and L2.

FIG. 6 is a diagram showing the shape of each of the wirings L1 and L2of the third embodiment. In planar view of the wiring area LA, each ofthe wirings L1 and L2 is gently curved in the wiring layer 30.

More specifically, each of the wirings L1 and L2 has two bend portionswithin the integration area IA. The radius of curvature of one bendportion is R1, and the radius of curvature of the other bend portion isR2. Between these two bend portions, each of the wirings L1 and L2crosses the C direction at the above-described angle θ.

According to the shape shown in FIG. 6, in the same manner as those ofthe first and second embodiments, a tensile stress 3σ to be applied toeach of the wirings L1 and L2 can be reduced. For example, the tensilestress 3σ is intermediate between the tensile stresses 1σ and σ2 shownin FIG. 4 (σ2<σ3<σ1).

In the wiring L1 or L2 shown in FIG. 4(b), stress tends to beconcentrated in such a location where the portion extending in the Cdirection and the portion inclined with respect to the C direction areconnected to each other. On the other hand, when the bend portion isgently curved as shown in FIG. 6, such concentration of stress can bemoderated.

The radii of the curvature R1 and R2 may be, for example, the same aseach other. However, the radii of curvature R1 and R2 may be differentfrom each other. To moderate the above-described stress concentrationmore effectively, the radii of curvature R1 and R2 (second radius ofcurvature) should preferably be greater than the radius of curvature ρ(first radius of curvature) of the bend area BA.

FIG. 7 is a schematic plan schematically showing the wiring area LAusing the wirings L1 and L2 formed into the shape shown in FIG. 6. Inthe example shown in the drawing, both the wirings L1 and the wirings L2are gently curved in the integration area IA. The bend area BA overlapsthe integration area IA.

In the example shown in FIG. 7, each of the wirings L1 and L2 closer toeach of the sides S1 and S2 has a larger radius of curvature R1, andeach of the wirings L1 and L2 closer to the center in the X directionhas a smaller radius of curvature R1. The same also applies to theradius of curvature R2. Accordingly, each of the wirings L1 and L2closer to each of the sides S1 and S2 crosses the C direction at alarger angle. Therefore, the stress to be applied, particularly, to thewirings L1 and L2 near the peripheral portions in the X direction can bereduced.

Note that, although each of the wirings L1 and L2 has two bend portionsin the present embodiment, each of the wirings L1 and L2 may have onlyone bend portion. Alternatively, each of the wirings L1 and L2 may alsohave three or more bend portions.

Fourth Embodiment

FIG. 8 is a schematic plan view of the wiring area LA of the fourthembodiment. In the example shown in the drawing, the shape of eachwiring L1 is similar to that of the first embodiment shown in FIG. 3,and the shape of each wiring L2 is similar to that of the thirdembodiment shown in FIG. 7.

That is, each wiring L1 in the integration area IA is inclined at theangle θ to the C direction and extends linearly. On the other hand, eachwiring L2 in the integration area IA is gently curved in two bendportions.

According to this structure, it is possible to have the same effect asthat of the first embodiment on each wiring L1 and the same effect asthat of the third embodiment on each wiring L2.

Fifth Embodiment

FIG. 9 is a schematic plan view of the wiring area LA of the fifthembodiment. In the example shown in the drawing, the shape of eachwiring L1 is similar to that of the second embodiment shown in FIG. 5,and the shape of each wiring L2 is similar to that of the thirdembodiment shown in FIG. 7. Note that, in the present embodiment, theintegration area IA varies between the wirings L1 and the wirings L2. Inthe following, the integration area of the wirings L1 will be referredto as an integration area IA1, and the integration area of the wiringsL2 will be referred to as an integration area IA2.

Each wiring L1 in the integration area IA1 is inclined at the angle θwith respect to the C direction and extends linearly. No space isprovided between the integration area IA1 and the third side S3. On theother hand, each wiring L2 in the integration area IA2 is gently curvedin two bend portions. Spaces are provided between the integration areaIA2 and the third side S3 and between the integration area IA2 and thefourth side S4, respectively. In the example shown in FIG. 9, theintegration area IA2 is included in the integration area IA1.

According to this structure, it is possible to have the same effect asthat of the second embodiment on each wiring L1 and the same effect asthat of the third embodiment on each wiring L2.

The first to fifth embodiments can be appropriately combined with eachother.

Although each embodiment has been described based on the assumption thatone wiring layer 30 is formed in the wiring area LA, a plurality ofwiring layers 30 may also be formed in the wiring area LA in such amanner that these wiring layers 30 are deviated from each other in thethickness direction of the wiring area LA. In that case, high tensilestress tends to be applied to the wiring layer 30 located on the outerside of the bend. Therefore, it is possible to set the outer wiringlayer 30 as the control target of the neutral plane control by themethod disclosed in the embodiment.

Further, all display devices which a person having ordinary skill in theart can implement by making appropriate design changes to the displaydevices described in the embodiments of the present invention will comewithin the scope of the present invention as long as they fall withinthe scope and spirit of the present invention.

Still further, it is natural for a person having ordinary skill in theart to conceive of various modifications of the present invention withinthe scope of the technical concept of the present invention, and suchmodifications will be encompassed by the scope and spirit of the presentinvention. For example, the above-described embodiments with appropriateaddition, deletion and/or design change of the structural elements, orappropriate addition, omission and/or condition change of themanufacturing process by a person having ordinary skill in the art willalso come within the scope of the present invention as long as they fallwithin the scope and spirit of the present invention.

Still further, concerning advantages other than those described in theembodiments, advantages obvious from the description of the presentinvention and advantages appropriately conceivable by a person havingordinary skill in the art will be regarded as the advantages achievablefrom the present invention as a matter of course.

What is claimed is:
 1. An electronic device comprising: a firstsubstrate including a first area including a plurality of switchingelements, a second area adjacent to the first area, and wirings; and anexternal circuit mounted on the second area of the first substrate,wherein the wirings are electrically connected to the external circuit,provided in the first area and the second area, and arranged in a firstdirection, at least one of the wirings in planar view of a first portionof the second area is curved with respect to a second directionorthogonal to the first direction, the first substrate in the firstportion is bent in a first radius of curvature, at least one of thewirings in planar view is bent in a second radius of curvature, and thesecond radius of curvature of the wirings increases from a peripheralportion of the second area to a central portion of the second area inthe first direction.
 2. The electronic device of claim 1, wherein thesecond area includes a first side parallel to the second direction, asecond side opposed to the first side, a third side connecting the firstside and the second side and parallel to the first direction, and afourth side opposed to the third side and connecting the first side andthe second side, and a width between the wiring closest to the firstside and the wiring closest to the second side decreases with increasingdistance from the third side.
 3. The electronic device of claim 2,wherein the width between the wiring closest to the first side and thewiring closest to the second side in the first direction changes at ahighest rate in the first portion.
 4. The electronic device of claim 2,wherein the second area includes an integration area in which at leastone of the wirings is inclined with respect to the second direction, thefirst portion overlaps the integration area, and spaces are providedbetween the integration area and the third side and between theintegration area and the fourth side.
 5. The electronic device of claim2, wherein the second area includes an integration area in which atleast one of the wirings is inclined with respect to the seconddirection, the first portion overlaps the integration area, and a spaceis provided between the integration area and the fourth side, and nospace is provided between the integration area and the third side. 6.The electronic device of claim 2, wherein the wirings include firstwirings and second wirings, and at least one of the first wirings isarranged between the second wirings and the first side, and the otherfirst wirings are arranged between the second wirings and the secondside.
 7. The electronic device of claim 6, wherein the second areaincludes a first integration area in which the first wirings areinclined with respect to the second direction, and a second integrationarea in which the second wirings are inclined with respect to the seconddirection, and the first portion overlaps the first integration area andthe second integration area.
 8. The electronic device of claim 7,wherein a space is provided between the second integration area and thethird side, and no space is provided between the first integration areaand the third side.
 9. The electronic device of claim 1, wherein thefirst substrate is bent along an axis parallel to the first direction.10. The electronic device of claim 9, wherein the external circuit andthe first substrate are attached to each other by an adhesive layer, andthe first substrate is maintained to be bended.
 11. The electronicdevice of claim 9, wherein the second direction is a directionorthogonal to the axis parallel to the first direction.
 12. Theelectronic device of claim 1, wherein at least one of the wirings in thefirst portion crosses the second direction at an angle of 10 degrees ormore.
 13. The electronic device of claim 12, wherein at least one of thewirings in the first portion crosses the second direction at an angle of30 degrees or more.
 14. The electronic device of claim 1, wherein anangle at which the wirings cross the second direction increases from acentral portion of the second area toward a peripheral portion of thesecond area in the first direction.
 15. The electronic device of claim1, wherein at least one of the wirings in the first portion does notorthogonally cross the first direction.
 16. The electronic device ofclaim 1, wherein the second radius of curvature is greater than thefirst radius of curvature.
 17. The electronic device of claim 16,wherein at least one of the wirings includes two or more bend portionswhich bend in the second radius of curvature.
 18. The electronic deviceof claim 1, wherein the wirings have a multilayer structure of titanium,aluminum, and titanium.